Magnetic Phone Cooling Plate (B Pro / E Pro) – Aluminum Heat Sink with Heat Pipe

This Magnetic Phone Heat Dissipation Plate is designed to expand the cooling area of your smartphone when used together with an external phone cooler. Ultra-thin and lightweight, it improves heat transfer efficiency and enhances cooling performance during gaming, livestreaming, or heavy use.

• Expands phone cooling area when paired with a phone cooler
• Ultra-thin design (~1.4mm) for minimal bulk
• Strong magnetic attachment using neodymium iron boron magnets
• High thermal conductivity aluminum alloy construction
• Pro versions include built-in heat pipes for better heat transfer

• Compatible with most smartphones
• Works best with external phone coolers (not included)
• Magnetic phones can attach directly
• Non-magnetic phones require adhesive installation

• Brand: NONE
• Product Type: Magnetic Phone Cooling Plate
• Material: Aluminum Alloy + Neodymium Magnet + Thermal Tape
• Heat Pipe: Included in B Pro / E Pro versions only
• Thickness: Approx. 1.4 mm
• Battery: No
• High-Concerned Chemicals: None
• Origin: Mainland China

• Measure your phone using a ruler to select the correct size
• If phone is magnetic, attach directly
• If non-magnetic, peel adhesive film and stick to phone back
• Attach external phone cooler onto the plate

• 1 × Magnetic Heat Dissipation Plate

• Must be used together with a phone cooler
• Not suitable for installation inside phone cases
• Wireless charging will be disabled after installation
• Please confirm dimensions before ordering